IC Package Designer
1 day ago
Bohemia
Job Description For more than 60 years, Data Device Corporation (DDC) has been recognized as a world leader in the design and manufacture of high-reliability Connectivity, Power, and Control solutions for the Aerospace, Defense, and Space industries. Our dedication to supplying quality products, on-time delivery, and superior support, has contributed to the success of our customers and the critical missions they serve. Pay range for this position is between $130,000 and $170,000 annually and will depend upon experience. This position is 100% onsite at our Bohemia, NY office. This position requires a U.S Person or a person who can qualify for a department of state or commercial license. Position Summary: We are seeking a skilled and detail-oriented IC Package Designer to join our engineering team. The ideal candidate will have in-depth knowledge of substrate design, package layout, signal integrity, and manufacturing constraints. This role will collaborate cross-functionality with the electrical, mechanical and manufacturing design teams to develop reliable, manufacturable, and cost-effective package design. • Design and Development: Lead the interconnect design for advanced electronic packaging solutions, including high-reliability flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures., • Verification and Validation: Perform comprehensive design verification ensuring that the package design meets all functional, electrical, thermal, mechanical, and manufacturability requirements, • Collaboration: Collaborate closely with substrate, material and package suppliers to align design with process capabilities and technologies to ensure design meets electrical and mechanical performance requirements., • Troubleshooting: Support Failure Analysis (FA) and root cause investigations related to the design, assembly, or performance of a package or substrate., • Optimization: Define and develop substrate stack-ups, routing strategies, via structures, and component placement to meet electrical and mechanical specifications., • Documentation: Maintain thorough documentation of design processes, test results, and revisions to ensure clarity and consistency for release packages for manufacturing., • Planning: Develop plans, schedules, and support technical reviews that are required to develop products from market requirement through product release., • Mentorship: Provide guidance and support to junior engineers, sharing expertise and best practices in package design and development., • Education: Bachelor’s degree in Electrical Engineering, Material science or related field., • Experience: 8+ years of experience in IC package design and development, • Tool Skills: Experience with package design tools from concept through release (e.g., Cadence Allegro package designer)., • Technical Skills: Proven experience with advanced packaging technologies (e.g., 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded, Flip Chip, stacked die using DAF or FOW, Chip-on-Wafer-on-Substrate, Ceramic Co-Fire, Printed Substrate in ceramic package, plastic encapsulated modules/BGAs)., • Knowledge: Strong understanding of substrate technologies (e.g., BT laminate, ABF, BeO, PTFE, KPPE, glass cloth resin), materials and manufacturing processes., • Problem-Solving: Excellent analytical and troubleshooting skills with a keen eye for detail., • Experience collaborating with OSATs and semiconductor foundries, including qualification and design feedback loops, • Knowledge of high-speed digital interfaces (PCIe, DDR, SerDes, etc.)., • Knowledge with package-level simulation tools to analyze signal quality and timing through package interconnects.