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Job DescriptionElectronics Package Design Engineer Primary Skills - package layout, signal integrity, flip chip, bga, ceramic, multi-chip modules, electronics packaging, system in package, cadence Job Description Electronics Packaging Design Engineer We are seeking an experienced Electronics Packaging Design Engineer to join our team. In this role, you will lead the design of advanced packaging solutions including flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures. You’ll collaborate with cross-functional teams and suppliers to deliver reliable, manufacturable, and cost-effective designs. Responsibilities: • Design interconnects, substrate stack-ups, routing strategies, and package layouts., • Verify designs against electrical, thermal, mechanical, and manufacturability requirements., • Partner with suppliers and internal teams to align designs with process capabilities., • Support failure analysis and root-cause investigations., • Document design processes and lead reviews from concept to release., • Mentor junior engineers and support packaging technology roadmaps. Qualifications • Bachelor’s in Electrical Engineering, Materials Science, or related field., • 8+ years in IC/electronic packaging design., • Proficiency with Cadence Allegro or equivalent tools., • Expertise in advanced packaging (2.5D/3D, interposers, HBM, fan-out WLP, wire bond, flip chip, stacked die, ceramic co-fire, encapsulated modules/BGAs)., • Strong knowledge of substrate technologies and manufacturing processes. Why is This a Great Opportunity Well-established, stable company. Long-term projects featuring great technology. They are a great team of people to work with. Employees work 5 days per week onsite. They MAY let an outstanding candidate work from home a couple of days per week. no sponsorship. local candidates only, but might consider someone who is originally from Long Island Powered by JazzHR i7G47Nxmah